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Smart Manufacturing

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Manufacturing capability

High-end & Intelligent Manufacturing System
  • Automated Flexible Production and Testing
  • Full-scenario Production Robots
  • Intelligent Warehousing System
  • Intelligent Logistics Distribution
  • Automated Material Receiving
  • Assembly Lines and Cellular Manufacturing
  • BTO (Build to Order)
  • CTO (Configure to Order)
  • Multi-variety and Small-batch Production
  • High Output
Sophisticated Process Technology
No-clean double-sided SMT and selective wave soldering
Assembly of Components with Ultra-fine 0.2 mm Pitch
0.2 mm Pitch BGA Assembly Technology
24-Layer PCB Assembly Process
High-density Crimping, FPC Flexible Circuits & Rigid-Flex PCBs
GPU 3248Pin · Type-C
PCB Dimension: 50×50 ~ 750×540 mm

Quality Policy

Every point reliable
Ensure every solder joint on our products is firm and reliable. Attend to every detail in daily work, enabling each employee to fully realize their personal value.
Perfect connections
Achieve perfect connection of intelligent controllers. Work together to build efficient processes and teams, and ensure smooth internal and external communication and collaboration.
Every aspect covered
Ensure every soldering surface of the product is precise and error-free. Consolidate comprehensive corporate strengths to deliver all-round value-added services for customers.
Always reaching new heights
Pursue ultimate perfection in products. Dare to challenge and pioneer innovation to realize the sustainable development of the enterprise.

Management System

ANSI/ESD S20.20 Electrostatic Discharge Control Management System
IATF 16949 Automotive Quality Management System
ISO 13485 Medical Devices Quality Management System
ISO 9001 Quality Management System
ISO 14001 Environmental Management System
ISO 45001 Occupational Health and Safety Management System
ISO 50001 Energy Management System
GB/T 23001 & GB/T 23006 Integration of Informatization and Industrialization Management System

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